Ambient Temperature Impact on the Thermal Behavior and Power Consumption of the NVIDIA Jetson AGX Orin in an Outdoor Enclosure
Rihards Krišlauks, Deniss Tiščenko, Vladislavs Medvedevs, Juris Ormanis, Jānis Judvaitis · Electronics · 2026
This paper presents a thermal and power characterization of the NVIDIA Jetson AGX Orin deployed in a realistic outdoor edge AI enclosure, integrated with power supplies, a Long Term Evolution (LTE) module, and a thermostat-controlled fan, across an ambient temperature range from −20 °C to +40 °C. The device was tested in a climate chamber under two workloads: a synthetic CPU and GPU stress test, and a YOLOv8s inference workload (TensorRT FP16, 640 × 640 input). Internal temperatures were recorded using four calibrated platinum Resistance Temperature Detectors (RTD)—PT100/PT1000, while Jetson chip temperatures and power consumption were logged via tegrastats and jtop. At sub-zero ambient temperatures, heat dissipated by the device itself kept all components within their operating ranges down to −20 °C. At the +40 °C setpoint, the stress test triggered Jetson thermal throttling at GPU and CPU temperatures of +95.6 °C and +99.0 °C, respectively. Under the same conditions, the YOLOv8s inference workload sustained 108.8 frames per second (FPS) at 19.1 W average power, approximately half of the 36.5 W consumed under the stress test, with chip temperatures well below the throttling threshold. These findings indicate that synthetic stress tests substantially overestimate the thermal and power demands of the tested inference workload, and that the enclosure retains sufficient thermal headroom for outdoor edge device deployment.