Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing
K. Fischer, Frank E. Abboud, Ritander Aggarwal, Payam Amin, Satyajit Anand, M. Asoro, C. Atay, Chris Auth, Muratahan Aykol, A. Badmaev, Balijeet Bains, Kale Beckwitt, John Marcus Bell, M. Bellah, Dhananjay Bhawe, J. Birdsall, William T. Blanton, James O. Bondi, Anupama Bowonder, J. Brooks · 2025
An advanced Intel 18A technology featuring RibbonFET and PowerVia provides over 30% density scaling and a full node of performance improvement compared to Intel 3. Intel 18A achieved 18%/25% performance (0.75V/1.1V) at iso-power over Intel 3 through an industry-first combination and optimization of advanced interconnects, a Gate-All-Around (GAA) transistor architecture, backside power, and design co-optimization. Intel 18A offers high-performance (HP) and high-density (HD) libraries with full-featured technology design capabilities and enhanced design ease of use.