BUP: A Deadlock Resolution Framework for 2.5D Chiplet Networks by Update Packet Bypassing
Tiejun Li, Jianmin Zhang, Yi Yang, Yan Ning Sun · IEEE Journal on Emerging and Selected Topics in Circuits and Systems · 2025
Interposer-based 2.5D integration, as a promising packaging technology, is extensively applied in chiplet-based systems. However, even if both the interposer and chiplets are deadlock-free, new deadlocks may still occur across them after integration. To address these, we have proposed a deadlock resolution framework called Boundary Update Packet (BUP) for 2.5D-chiplet systems. BUP keeps path diversity for inter-chiplet packets routing and supports each chiplet can be independently designed. BUP ensures the freedom of routing design while simultaneously supporting fault-tolerant routing. The experimental results have shown that as compared with previous deadlock-free designs in 2.5D-chiplet systems, BUP achieves an average performance improvement of 13% under synthetic traffic; While under real-application workloads, BUP provides an average runtime speedup of 3.5% with an area overhead of less than 6%.