Next Generation Chiplet Technology Development: Focusing on Fine RDL Patterning
Masaru Sasago, H. Nishizawa, T. Doi, Mitsuru Ozono, H. Kimuro, S. Yamamoto, Keisuke Suzuki, S. Takahashi, YUJI MINAMI, Masahiro Yasuda, Y. Hirai, Takamitsu Saito · 2025
To achieve high performance and low transmission loss in the next generation chiplets, fine-pitched hybrid bonding and fine Redistribution Layer (RDL) formation are key technologies. This paper reports on the established short- Turn-Around- Time (T AT) material development consortium named RCS consortium to screen new, photo or non-photo-sensitive dielectric organic materials by utilizing both front-end technologies, fine Lithography and Damascene Chemical Mechanical Polishing (CMP), and the development of high-performance materials and RDL patterning processes.