Heterogeneous Integration for MMICs Based on Embedded Chip and Flip Chip Technology
Haoning Zou, Zhiyu Qian, Enlin Wang, Yongrong Shi · 2024
In this paper, the heterogeneous integration for monolithic microwave integrated circuits (MMICs) is studied based on embedded chip and flip chip technology. For evaluation of the millimeter-wave interconnection for the heterogeneous integration, 1-to-2 power divider GaAs chips are applied as the prototype of the MMIC to establish the simulated model, which are packaged in the form of embedded chip and flip chip. High resistance silicon (HRS) is used as the interposer for such three chips to build millimeter-wave power distribution network. Finally, the related measurement printed circuit board (PCB) is designed for the above heterogeneous integrated packaging substrate using gold wire bonding for connections, and Endlaunch connectors are used for the vector network analyzer. The heterogenous integrated millimeter-wave power distribution network can operate between 26 GHz and 40 GHz. The return losses are greater than $\mathbf{1 5 ~ d B}$, and the output isolation levels are greater than $\mathbf{2 0} \mathbf{d B}$.