Tomorrow's Modular & Scalable Compute Systems
Aleksandar Aleksov, Georgios C. Dogiamis, Adel A. Elsherbini, Johanna M. Swan · 2024
The demand for AI solutions across markets requires software-hardware co-optimization with a focus on system performance and energy efficiency with affordability. To achieve manufacturing at scale, three key packaging thrusts require focus on fungible solution enablement: i) advanced memory integration to eliminate capacity, bandwidth and latency bottlenecks, ii) utilization of hybrid bond (HB) interconnect pitch scaling to access power-efficient, bandwidth density between heterogeneous components, and iii) modularity and system expansion with connectivity to avoid networked latency and bandwidth limitations. The combination of these elements while utopian in vision face numerous challenges which need addressed.