Toward Standardized Vulnerability Assessment of Advanced Packaging Against Probing Attacks
M Shafkat M Khan, Liton Kumar Biswas, Himanandhan Reddy Kottur, Rouhan Noor, Nitin Varshney, Nelson Hastings, Navid Asadizanjani · IEEE Design and Test · 2025
Editor’s notes: The emergence of heterogeneous integration (HI) and advanced integrated circuit (IC) packaging significantly improves device performance; however, it concurrently amplifies susceptibility to probing attacks, thereby necessitating the establishment of new security assessment standards. This article presents a quantitative framework designed for the evaluation of these vulnerabilities, bolstered by empirical analysis and discussions regarding potential countermeasures.—Kanad Basu, University of Texas at Dallas, USA