Effect of Power Module Architecture on Common Mode Electromagnetic Interference
Taha Moaz, Christina DiMarino, Narayanan Rajagopal, Richard Zhang, Dushan Boroyevich, Michael Fish · 2024
Wide bandgap (WBG) semiconductor devices generate a substantial amount of conducted common mode (CM) electromagnetic interference (EMI) due to their ability to operate at higher switching frequencies, higher operating voltages, and faster slew rates. A wealth of power module architectures has been explored in literature for mitigating EMI at the module packaging level; however, these architectures have been tested under different conditions and use different analysis methodologies to explain their mitigation results. This makes it difficult to compare the EMI performance of different module architectures. In this work, the CM EMI emissions of eight module architectures are explored to understand the relationship between the package design and EMI mitigation. An in-dept analysis on the EMI behavior of the eight module architectures is conducted, and the EMI trends and underlying mitigation principles are explained by highlighting key differences in the architecture.