Effect of Ground Solder Ball Failure on Signal Interference between Channels
Tianting Zhao, Kaixuan Song, Yue Zhuo, Chaoyi Wang, Qing Miao, Tianmeng Zhang, Jinchun Gao · 2024
As a high-density package, ball grid arrays (BGA) are widely used in electronic products. However, the complex environment may lead to solder ball failure, which in turn causes serious inter-channel crosstalk. For this problem, this paper researched the effect of ground solder ball failure on inter-channel crosstalk in terms of high-frequency parameters and time-domain waveforms. Firstly, an electromagnetic field model of two signal transmission channels with BGA packages was developed to analyze effect of the solder ball failure on$S$parameters. Then, a time-domain simulation system of the two signal transmission channels was also developed to analyze effect of the solder ball failure on the time domain signal waveforms. Finally, frequency-domain and time-domain tests were conducted to verify these simulation models and conclusions.