A Co-Planarized Common Cathode Micro-LED Display That Is Produced Using Planarization and a Copper Process
Yung-Ru Chen, Shoou‐Jinn Chang, Ting‐Jen Hsueh · IEEE Electron Device Letters · 2024
This study uses advanced 3D packaging planarization and a copper process to manufacture a co-planarized common cathode Micro-LED display. The experimental results show that SiO2and copper electrodes are at the same height and lie in a horizontal line after a chemical mechanical polishing (CMP) process. Compared with a conventional Micro-LED display structure, the copper electrode has a lower starting voltage of 2.72V. In addition, when the electrodes were operated for 19 mA, the temperature of the copper electrode structured Micro-LED also is$2.2~^{\circ }$C cooler. Therefore, the self-heating effect that is inherent in light-emitting diodes (LEDs) is mitigated by the superior thermal conductivity of copper.