COOL CHIPS 2024 Chair Message
2024
Message from the Organizing Committee ChairIt is my great pleasure to welcome you to COOL Chips 27, the 27th IEEE Symposium on Low-Power and High-Speed Chips and Systems.This program has been back to in-person format from last year after three-year of online/hybrid format.COOL Chips started in 1998, which was held as a one-day event of invited talks.Now COOL Chips is a three-day event fully sponsored by IEEE Computer Society.In the era of AI, IoT and data centric computing, power crisis in computing is getting serious issue for the sustainable society, and the role of COOL Chips is becoming increasingly important.I hope these three days of the symposium inspire innovative ideas for COOL-Chips-related researchers and engineers.In organizing the program of COOL Chips 27, Program Chairs Ryusuke Egawa (Tokyo Denki Univ.) and Yutaka Wada (Meisei Univ.) did an excellent job.They brought together an outstanding Program Committee and together composed an interesting program for COOL Chips 27, in collaboration with Vice Program Chairs Ryohei Kobayashi (Univ. of Tsukuba) and Ryuichi Sakamoto (Tokyo Tech.).COOL Chips 27 features keynote and invited talk sessions, invited lecture sessions, regular sessions for 15 peer-reviewed papers, a poster session and a panel discussion.The keynote and invited talks cover a wide variety of topics, which are energy-efficient AI SoCs, advanced packaging, and various in-memory-computing of analog AI acceleration, optical neural networks and application to DRAM.The invited lectures are on aging-aware reliable system and radiation-hardened SoCs.