Flexible Electronic Encapsulation
Tao Yu · 2024
The development of encapsulation technology and materials mutually complements, constrains, and promotes each other. Flexible electronic encapsulating materials are classified as inorganic, organic, and organic-inorganic hybrid materials. Inorganic materials for electronic encapsulation can be divided into metal and ceramic encapsulating materials. Metal encapsulation utilizes metals such as copper, aluminum, tungsten, molybdenum, or copper-tungsten alloys as the main material for the tube shell, with the lead connecting internal and external circuits. In addition to inorganic systems, encapsulating materials include organic systems and composite systems. Organic materials are often used as substrates and sealing materials. Inorganic-organic hybrid materials have been widely used in many applications due to their unique chemical and physical properties and the advantages of both organic and inorganic materials. The composite of inorganic-organic hybrid materials can form a variety of functional materials such as optical materials, high-temperature resistant materials, and mechanical materials.