Structural design and mechanical analysis for space-borne electronic equipment
Qifeng Yin, Fei Xue, Li Shen · Journal of Physics Conference Series · 2023
Abstract With the development of a new generation of radar performance requirements, the chip integration and module assembly density of onboard electronic equipment have been greatly improved. The integration of the system is becoming more complex. This paper designs a kind of electronic equipment with a superposition structure. Separate functional modules are strung together by a screw. Each module unit has the same sectional size. The conventional cabinet form structure is abandoned. The main contradiction of volume, weight, and reliability is solved well. The mechanical properties of electronic equipment are analyzed by the finite element method, and the structure of the fixed lug is optimized. The result shows that the electronic equipment meets the requirements of structural safety margin. The structural design is safe and reliable.