IEEE WMED 2023 Keynote Address
2023
We are living amid a data revolution, both from a generation and consumption perspective.From AI chatbots and cloud storage, to smart homes, 5G, and autonomous vehicles, our world is full of digital hoarders that are driving demand higher and faster than our current memory and storage hierarchy can support.End users continue to demand more: more storage, faster data, higher performance, and novel solutions that make life better for all.At the same time, our memory solution technologies are facing profound scaling challenges as the industry continues to push beyond the boundaries of Moore's Law.Performance, power, and reliability requirements that met our needs in the past cannot keep pace with the digitization of our global economy.With these challenges in mind, we have already started down the 3D path for NAND and now DRAM, but we must do more!New applications and use models are accelerating development and interest for in-memory compute, near-memory compute, memory pooling, and heterogenous solutions.Now is the time to drive these heterogenous solutions that will revolutionize the hierarchy and ultimately lead to a convergence of memory and storage.Advanced Packaging solutions are well positioned to enable this new and expanded hierarchy and will become an integral part of a new ecosystem that will extend the memory roadmap well into the future.As we continue to increase focus on more sustainable and cost-effective solutions, we must also begin building the infrastructure required to support this new memory -storage hierarchy, by developing a front-end like packaging supply chain and a robust, packaging-focused talent-based pipeline.Our focus in these areas today will pave the way for new and exciting innovations and experiences for generations to come.