The performance optimization of thermal conducting ability of the microprocessor using heat transfer management model
Richa Mehta, G. Sathesh Kumar · 2022
Thermally conductive paste consists of a plastic material with high thermal conductivity. Its purpose is to improve the heat transfer processes between the heating and the processor. Thermal grease “KPT-8” is produced in the form of a homogeneous paste of white or gray color, sometimes it has a blue or silver color. In the past, processors were cold-sorted, so they dispensed this material. Currently, such a paste is needed by anyone, even a low-power processor unit. over clocking is provided by modern processors manufacturers, it is achieved by programming, the user must make changes to the settings using the BIOS system. Due to the thinness of the processor and the heat sink, an air gap is formed, which reduces the heat dissipation of the microprocessor. This problem is particularly relevant at present, because many units are operating at the limit of their capabilities, while heat is actively released.