TCAR: Thermal and Congestion-Aware Routing Algorithm in a Partially Connected 3D Network on Chip
Majid Nezarat, Masoomeh Momeni · 2022
3D Network-on-chip architecture outperforms 2D ones in terms of area and latency. Layers in 3D NoC are connected by Through-Silicon Via (TSV), which imposes high implementation cost. Partially connected 3D NoCs are introduced to overcome this challenge. On the other hand, thermal issue and congestion are the main challenges in 3D NoCs. High temperature leads to aging which creates permanent and transient defects and reduces the reliability. Congestion issue can also reduce NoC performance and exaggerate the thermal challenges. In this paper, we presents a partially connected three dimensional NoC, in which a two-step routing algorithm is proposed based on the thermal and congestion weight coefficient assignment. The packets are routed due to the distance of the layers from the heat sink and network congestion status to select optimum path. The simulation results indicate 48% performance improvement compared to the recent partially-connected routing algorithms.