On Evaluation of On-chip Thermal Covert Channel Attacks
Jiachen Wang, Xiaohang Wang, Yingtao Jiang, Amit Kumar Singh, Letian Huang, Mei Fang Yang · 2022
Thermal covert channel (TCC) attacks have been a serious security concern to the use of many-core chips. Severity of these attacks is directly linked to the TCC’s transmission rate and its BER (bit error rate) performance, both of which are impacted by the transmission characteristics of thermal signals and adopted encoding, modulation, and multiplexing schemes. This paper examines, compares, and analyzes various TCCs built upon different combinations of encoding, modulation, and multiplexing. In particular, our study shows that TCC using non-return-to-zero (NRZ) line coding and frequency shift keying (FSK) modulation achieves the highest throughput of 120 bps and BER of below 10%.