Physical Security Roadmap for Heterogeneous Integration Technology
Aslam Ali Khan, Chengjie Xi, Navid Asadizanjani · EDFA Technical Articles · 2022
Abstract Interposers play an important role in 2.5D and 3D packages, routing power and communication signals between dies while maintaining electrical contact with I/O pins. This role and their relatively simple construction makes interposers a target for malicious attacks. In this article, the authors assess the vulnerabilities inherent in the fabrication of interposers and describe various types of optical attacks along with practical countermeasures.