Graphene-Based Wireless Agile Interconnects for Massive Heterogeneous Multi-Chip Processors
Sergi Abadal, Robert Guirado, Hamidreza Taghvaee, Akshay Kumar Jain, Elana Pereira de Santana, P. Haring Bolívar, Mohamed Saeed, Renato Negra, Zhenxing Wang, Kun‐Ta Wang, Max C. Lemme, Joshua Alexander Harrison Klein, Marina Zapater, Alexandre Levisse, David Atienza, Davide Rossi, Francesco Conti, Martino Dazzi, Geethan Karunaratne, Irem Boybat · IEEE Wireless Communications · 2022
The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networks-in-Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position article makes the case for wireless in-package networking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a wireless vision and the main research challenges toward its realization are analyzed from the technological, communications, and computer architecture perspectives.