Analysis of the Security Vulnerabilities of 2.5-D and 3-D Integrated Circuits
Vaibhav Venugopal Rao, Avesta Sasan, Ioannis Savidis · 2022 23rd International Symposium on Quality Electronic Design (ISQED) · 2022
The need for greater functionality on a single integrated circuit (IC) has directly resulted in novel techniques, methodologies, and processes that increase device density. In addition to device density, the advent of 2.5- D and 3-D integration has allowed for the development of complex heterogeneous systems, where intellectual property (IP) across multiple vendors and from different process nodes and foundries are placed in close proximity. Although 2.5- D and 3-D integration opens the door to enhanced circuit functionality, the physical security of such systems, which was already a challenge with 2-D integrated circuits, is of greater concern. The potential for sourcing and integrating adversarial IP including hardware Trojans, placing untrusted ICs, leaking critical circuit functionality or user data through side-channels, or even allowing for attack through the exploitation of side-channels must be considered. In this paper, a thorough analysis of the security vulnerabilities of 2.5- D and 3-D integrated circuits to Trojan insertion and side- channel attack is provided, with the goal of highlighting the importance of considering the security implications of such systems during design.