Recent developments in high integration multi-standard CMOS transceivers for personal communication systems
J.C. Rudell, Jia-Jiunn Ou, R.S. Narayanaswami, G. Chien, J.A. Weldon, Lin Li, King-Chun Tsai, Luns Tee, Khai Ling Khoo, Danelle Au, Troy Robinson, Danilo Gerna, M. Otsuka, P.R. Gray · 2002
Issues associated with the integration of transceiver components on to a single silicon substrate are discussed. In particular, recently proposed receiver and transmitter architectures for high integration are examined on the promise of providing multistandard capability. In addition, existing barriers to lower power transceiver operation are examined as well as some proposed directions for future integrated transceiver research and development.