Exploring Fault Injection Attack Resilience of Secure IC Chips : Invited Paper
Makoto Nagata · 2022 IEEE International Reliability Physics Symposium (IRPS) · 2022
Fault injections and attacks on an integrated circuit (IC) chip using a variety of physical measures are reviewed. Laser fault injection (LFI) is highlighted for the essential vulnerability on the backside of an IC chip in flip-chip packaging. On-chip voltage waveform monitoring characterizes the voltage peaks induced by LFI and establishes the detection scheme against LFI attacks. The backside buried metal (BBM) technique is deployed by preventive measures for shielding from laser exposure, for avoidance and also waring of invasive laser attacks. The alleviation of backside LFI is proven by Si experiments with on-chip waveform monitoring.