Signal Integrity Analysis
Afreen Khursheed, Kavita Khare · 2021
The final chapter concludes with its first section presenting the brief discussion on signal integrity challenges encountered when modeling state-of-the-art nano interconnects. As feature size decreases due to scaling of device dimensions, the reliability is compromised. The decrease in reliability is due to electromigration-induced problems. At a very high frequency of operation, the tightly packed nano interconnects produces transient crosstalk. Furthermore, analysis on how the crosstalk noise strongly influences the signal propagation delay and causes the circuit malfunction or functional failure is done. As the crosstalk noise causes signal overshoot, undershoot and ringing effects, hence it is enviable to develop a perfect pedagogical model for analytically analyzing the crosstalk effects occurring in nano interconnects. For this reason, the later part of this chapter presents a precise and time-efficient model of FET-gate driven coupled (Copper/CNT/GNR) nano interconnects in order to commensurate the crosstalk incited performance analysis of nano interconnects. The model discussed is formulated by finite difference time domain (FDTD) methodology for DIL system by assimilating boundary conditions for all the three types of interconnect materials.