Heterogeneous Industry Collaboration and System CAD Navigation for Advanced Package Failure Analysis
Arpan Bhattacherjee, Anand Shankar OT, Arshdeep Singh, Mehak Singla · Proceedings - International Symposium for Testing and Failure Analysis · 2021
Abstract The emergence of heterogenous integration driven by system-in-package (SiP) technology not only increases the complexity of semiconductor failure analysis, but also makes it more difficult to protect intellectual property because of the growing need to share design information to facilitate fault isolation in assembly and test. One way to address these challenges is through a computer-aided design (CAD) database that can be navigated across multiple components without exposing sensitive information. This paper describes the development and use of such a resource and how it enables safe and secure data sharing among supply chain partners.