Study on Warpage after Post Solidifying of Ultrathin Fingerprint Package Products
Ning Sun, Xiaojian Ma, Fang Qu, Qiang Wei, Huan Ping Yang, Weidong Liu, Ting Cao · 2021
With the decrease of mobile electronic product volume and weight, fingerprint packaging products used for unlocking need thinner structure. Warpage may occur in ultrathin plastic seal products which seriously affects the producibility of the product. Because of the difference of thermal expansion coefficient of each material in fingerprint packaging products, warping deformation is easy to occur after curing. This paper studies the key factors (material characteristics, product structure, etc.) which affect the warpage of fingerprint products. For a fingerprint packaging product, ANSYS is used Simulation analysis software, the material parameters and product structure are simulated and optimized, and the experimental results show that the combination of simulation and experiment can effectively control and optimize the warpage of the package, which is of great significance to ensure the production of fingerprint products.