Exploring flexible and 3D printing technologies for the design of high spatial resolution EM probes
Julien Toulemont, F. Mailly, Philippe Maurine, Pascal Nouet · 2021
Electromagnetic analysis of the field radiated by ICs is a common practice in the field of hardware security, especially for reverse engineering or to disclose cryptographic keys. While surprisingly the scaling of CMOS technologies carries on, it is important to scale down the sensors used to perform such analyses. Within this context, this paper explores the potential of flexible and 3D printing technologies to design low cost, electrically and mechanically robust electromagnetic probes with spatial resolution about 50μm while the standard is currently about 100μm.