Optimal Design of PCB Layout Based on Thermal Analysis Using Taguchi Method
Sun Wei, Ye Li, Shaokun Zhang, Shi Qibiao · 2021 3rd Asia Energy and Electrical Engineering Symposium (AEEES) · 2021
The power density of power electronics systems and the temperature of components on Printed circuit boards (PCB) are increasing higher and higher with the rapid development of power electronic technology, and optimizing the layout of PCB based on thermal analysis is becoming more and more important. A thermal simulating model of PCB in a self-developed controller for electric vehicles was built and the layout of components on PCB was optimized using Taguchi Method in this paper. The optimization process was carried out and the locally optimal solution was analyzed and verified by the simulation.