Test infrastructure design for core-based system-on-chip under cycle-accurate thermal constraints
Thomas Edison Yu, Tomokazu Yoneda, Krishnendu Chakrabarty, Hideo Fujiwara · 2009
We present a thermal-aware test-access mechanism (TAM) design and test scheduling method for system-on-chip (SOC) integrated circuits. The proposed method uses cycle-accurate power profiles for thermal simulation; it also relies on test-set partitioning, test interleaving, and bandwidth matching. We use a computationally tractable thermal-cost model to ensure that temperature constraints are satisfied and the test application time is minimized. Simulation results for the ITC'02 SOC Test Benchmarks show that, compared to prior thermal-aware test-scheduling techniques, the proposed method leads to shorter test times under tight temperature constraints.