Issues and Key Technologies for Next Generation 3D NAND
Chi-Weon Yoon, Hyung-Gon Kim, Seon‐Kyoo Lee, Jin-Yub Lee, Jaihyuk Song · 2021 International Conference on Electronics, Information, and Communication (ICEIC) · 2021
In this paper, design challenges and key technologies to overcome the hurdles for the future 3D NAND are introduced. More specifically, state-of-the-art solutions for higher density, lower cost and higher bandwidth NAND is covered in detail.