A New Path Planning Method for Flying Probe Test Arms
Wentao Li, Jingjie Yang, Xiaojun Lv, Jianrong Wang · 2020
Whether the circuit components are soldered correctly is an important part to ensure that a printed circuit board (PCB) can be used normally. Calculating the path of detecting each component successively can be regarded as a traveling salesman problem (TSP). This paper presents a novel path planning method for PCB testing by flying probe and introduces the flow and rules of our proposed method. Through a large number of experiments, we can demonstrate that the proposed algorithm reduces the path length and the time required to obtain the best solution effectively.