A Fast Side-Channel Leakage Simulation Technique Based on IC Chip Power Modeling
Akihiro Tsukioka, Karthik K. Srinivasan, Shan Wan, Lang Lin, Ying–Shiun Li, Norman H. Chang, Makoto Nagata · IEEE Letters on Electromagnetic Compatibility Practice and Applications · 2019
Hardware-based secure integrated circuit (IC) chips with implemented cryptographic algorithms are vulnerable to practical attacks analyzing side-channel (SC) leakage such as electromagnetic radiation. Correlation power analysis (CPA) is a real threat to secret key crypto ICs. Therefore, the information leakage risks need to be evaluated at the design stage of secure devices. This letter proposes a fast power leakage simulation method for hardware-implemented cryptographic ICs. The power delivery network (PDN) of cryptographic hardware including a silicon substrate is modeled by a chip power model (CPM) and a chip package system (CPS) board model. The proposed method was applied to the advanced encryption standard (AES) test chip implemented by the flip-chip ball grid array (FC-BGA) assembly technology. The simulation results are evaluated by CPA for the SC leakage during plaintext encryption propagating through PDN and silicon substrate. The measurement and simulation successfully find 128-bit secret key on CPA attack. The proposed simulation technique reduces the time required in the exploration of SC leakage risks for secure device designs.