Arduino Based Conductive Silver Lamination Device
Fitria Hidayanti · International Journal of Emerging Trends in Engineering Research · 2020
This study has designed laminated devices for Arduino-based conductive silver ink patterns on flexible materials.The resistance of the conductive pattern of silver ink in a flexible Printed Circuit Board (PCB) applications is still quite high and reduces electrical conductivity.Resistance can be reduced by hot lamination of flexible materials with specific optimum temperatures in the material.Research methods carried out by conductive pattern of silver ink heat lamination on flexible materials.The lamination device consists of a heating lamination controlled by an Arduino microcontroller.The measured resistance before lamination as 2.8 ohms and after lamination with the lowest value as 0.1 ohms.The results of the conductive pattern lamination are tested with LED and battery circuits.The conductive pattern testing with LED circuits ensures that the Arduino-based conductive silver ink lamination device can function well.