Temperature Sensing and Data Transmission Mechanism for High Temperature Applications
Kuruparan Shanmugalingam, Dulanjana Liyanagama, Rubisha Rubanathan, Subramaniam Thayaparan · 2019
Most of the electronic devices do not perform well in high temperature. In wafer fabrication, data propagation through thick metallic chamber walls need more transmitting power for successful data transmission. Measuring and transmitting temperature in closed metallic high temperature environment is a challenging issue. In this paper, a scheme to sense, process and transmit the data through fully closed and thick Aluminum chamber is proposed. The system is capable of sensing high temperature while handling for power fluctuations. Temperature is measured using tiny RTD resistors placed in different 7 locations up to 350 degree Celsius. The data is transmitted as radio-waves using ASK and FSK modulation techniques at the rate of 1 kbps. Processed demodulated data at the receiver-end provides the power supply voltage level, RTD locations ID, and the temperature in different locations of the IC inside the chamber real-time. Re-transmission technique is proposed to reduce the propagation loss. It ensures possibility of the transmitter to work in low power environment. Experimental results show the effectiveness of the proposed system to over come the limitations of measuring and transmitting real-time data.