On-chip wireless interconnect paradigm
Barış Taşkın · 2019
On-chip wireless interconnects offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. The on-chip wireless interconnect field is a thriving research frontier, with small (in-package) and large (across server racks) scale innovations. This talk will review the primary focus and the supporting periphery being researched for on-chip wireless interconnects. For instance, the recent discovery of a through-silicon via antenna (TSV_A) will be highlighted for adaptability to a wide range of packaging medium that includes silicon-interposer based multichip packages. Projections of TSV_As indicate up to 40 dB improved signal strength compared to other on-chip antennas, with an insertion loss of 3-5 dB up to a 30 mm distance.