Test-Plan Optimization for Flying-Probes In-Circuit Testers
Luciano Bonaria, Maurizio Raganato, Giovanni Squillero, Matteo Sonza Reorda · 2019
The test of a printed-circuit board assembly often includes in-circuit test, which mainly aims at checking whether the different components have been correctly soldered. A tester may adopt either the bed of nails, or the flying-probes architecture. In the latter case, probes move to contact test points on each side of the board in order to perform the required tests. In order to minimize the test time, the sequence of movements of the probes should be re-arranged, considering the tester capabilities, the board layout, and several constraints coming from the environment and the customer. In this paper we describe the approach developed for optimizing tests on the SPEA 4080, which combines reduced test time with short test-generation time. Experimental results show the effectiveness of the proposed solution.