Runtime thermal management of many-core systems
Anup Kumar Das, Akash S. Kumar · Institution of Engineering and Technology eBooks · 2019
Chapter Contents: 9.1 Thermal management of many-core embedded systems 9.1.1 Uncertainty in workload estimation 9.1.2 Learning-based uncertainty characterization 9.1.2.1 Multinomial logistic regression model 9.1.2.2 Maximum likelihood estimation 9.1.2.3 Uncertainty interpretation 9.1.3 Overall design flow 9.1.4 Early evaluation of the approach 9.1.4.1 Impact of workload uncertainty: H. 264 case study 9.1.4.2 Thermal improvement considering workload uncertainty 9.2 Thermal management of 3D many-core systems 9.2.1 Recent advances on 3D thermal management 9.2.2 Preliminaries 9.2.2.1 Application model 9.2.2.2 Multiprocessor platform model 9.2.2.3 3D IC model 9.2.3 Thermal-aware mapping 9.2.3.1 Thermal profiling 9.2.3.2 Runtime 9.2.3.3 Application merging 9.2.3.4 Resource allocation 9.2.3.5 Throughput computation 9.2.3.6 Utilization minimization 9.2.4 Experimental results 9.2.4.1 Benchmark applications 9.2.4.2 Target 3D many-core system 9.2.4.3 Temperature simulation 9.2.4.4 Interconnect energy computation 9.2.4.5 Thermal profiling results 9.2.4.6 Benchmark application results 9.2.4.7 Case-study for real-life applications 9.3 Conclusions and future directions References Inspec keywords: thermal management (packaging); multiprocessing systems; parallel processing Other keywords: submicron technology nodes; high-performance computing; leakage power; many-core systems; system-on-chip; thermal management Subjects: Product packaging; Multiprocessing systems