Three-dimensional stacking IC packaging technology for NAND-flash memory
Valentin Perminov, Vadim V. Putrolaynen, Aleksei Sergeevich Shtykov, A V Yartsev · IOP Conference Series Materials Science and Engineering · 2019
Abstract The article presents the technology of three-dimensional multi-chip packaging and testing of NAND memory module implemented at GS Nanotech in collaboration with Petrozavodsk State University. The main technological operations and quality management methods at each stage of memory modules manufacture are described. These memory modules can be used for solid-state drives production.