Designing vertical processors in monolithic 3D
Bhargava Gopireddy, Josep Torrellas · 2019
A processor laid out vertically in stacked layers can benefit from reduced wire delays, low energy consumption, and a small footprint. Such a design can be enabled by Monolithic 3D (M3D), a technology that provides short wire lengths, good thermal properties, and high integration. In current M3D technology, due to manufacturing constraints, the layers in the stack are asymmetric: the bottom-most one has a relatively higher performance.