Design of 3D Inductors for IoT Security
Bruce Kim, Sang‐Bock Cho · 2018
This paper describes the design of through-silicon via (TSV)-based inductors for security of Internet-of-Things (IoT). We designed 3D inductors with security hardware using physically unclonable function (PUF) circuit. The secure 3D inductor could be tuned to desirable frequency by using MEMS switches.