Module’s overheating assessment with the use of supply current waveform analysis
Damian E. Grzechca, Paweł Rybka, Sebastian Temich · IFAC-PapersOnLine · 2018
Design and manufacturing of electronic modules is a difficult process - on the one hand there arises a problem of developing the inner circuitry of best possible performance, on the other hand -building it at the lowest possible price. When it comes to cutting expenses on production, even the smallest changes in materials can critically influence the total manufacturing costs. The paper introduces a method of detecting certain module’s overheating levels without a necessity of using temperature sensors - devices generating unnecessary fabrication expenses. The assessment of temperature can be performed with the use of supply current waveform analysis - particular changes in current function caused by overheating may be processed and correlated with a certain temperature. Finding those differences in supply waveforms and classifying them may be done with either analytic methods or heuristic algorithms.