A fast and flexible software for IC reverse engineering
Gyungtae Kim, Ming Ma, Inhag Park · 2018 International Conference on Electronics, Information, and Communication (ICEIC) · 2018
This paper presents a fast and flexible CAD tool for Reverse Engineering (RE) in the semiconductor industry. It has applied various techniques such as the web-based service, big image acceleration algorithm, and automatic generation for circuit extraction. As a result of conducting the RE with the self-manufactured ROIC chip, it was confirmed that the analog circuit was exactly extracted as the gate level.