Next Generation Xeon Server Package Architecture
Raja Swaminathan, Ram Viswanath, Sriram Srinivasan, Arun Chandrasekhar · IMAPSource Proceedings · 2017
Abstract Semiconductor industry is moving towards more and more integration to provide more functionality and add value to the processor, thereby enabling better user experience. This integration can come in 3 categories: On-die integration, On-package integration, and On-board integration. On-board integration is the typical method being used for several generations and on-die and on-package integration architectures are getting more focus due to better performance and reduced power. The key vector to enable on-die/package architectures is reduced cost and maximum features for a given substrate and socket form factor. Silicon features are also moving at a faster pace compared to the board technology. This paper details a novel package (PoINT) architecture as well as the key technology challenges that were resolved to successfully enable this architecture.