Development of a 1.85 mm coaxial blind mating interconnect for ATE applications
Bill Rosas, Jose Moreira, Daniel Lam · 2017
The continuous increase of the I/O data rate and frequency of large volume integrated circuits creates significant challenges on the interconnect to the device under test (DUT) printed circuit board test fixture for automated test equipment (ATE). In this paper we will present a blind mating interface for ATE systems based on a 1.85 mm coaxial geometry to achieve a 65 GHz bandwidth guaranteed interconnect. We present measured S-parameters and also data eye diagrams for a 100 Gbps NRZ application.