A Throughput Study for Channel Bonding in IEEE 802.11ac Networks
Mun-Suk Kim, Tanguy Ropitault, SuKyoung Lee, Nada Golmie · IEEE Communications Letters · 2017
Several analytical models for the channel bonding feature of IEEE 802.11ac have previously been presented for performance estimation, but their accuracy has been limited by the assumptions that there are no collisions or all nodes are in saturated state. Therefore, in this letter, we develop an analytical model for the throughput performance of channel bonding in IEEE 802.11ac, considering the presence of collisions under both saturated and non-saturated traffic loads, and our numerical results were validated by a simulation study.