Superconducting Caps for Quantum Integrated Circuits
William B. O’Brien, Mehrnoosh Vahidpour, Jon Tyler Whyland, Joel Angeles, Jayss Marshall, Diego Scarabelli, Genya Crossman, Kamal Yadav, Yuvraj Mohan, Cat-Vu H. Bui, Vijay Rawat, Russ Renzas, Nagesh Vodrahalli, Andrew J. Bestwick, Chad T. Rigetti · arXiv (Cornell University) · 2017
We report on the fabrication and metrology of superconducting caps for qubit circuits. As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an enclosure that provides isolation, increases vacuum participation ratio, and improves performance of individual resonant elements. Here, we demonstrate that such caps can be reliably fabricated, placed on a circuit chip, and form superconducting connections to the circuit.