Dynamic Buffer Allocation for thermal-aware 3D network-on-chip systems
Ciao-Ting Chou, Yen-Po Lin, Kai-Yu Chiang, Kun-Chih Jimmy Chen · 2017
The thermal problem of 3D NoC system becomes severer than 2D NoC systems due to the different heat dissipation capability between each stacking die, which increases the power density and worsen the thermal issue. Hence, many Dynamic Temperature Managements (DTMs) are proposed to control the system temperature. The DTM is classified into temporal approaches and spatial ones by considering either only temperature or only traffic problem. To combine the advantages of the both aforementioned approaches, we propose a Dynamic Buffer Allocation (DBA) technology to worsen traffic congestion of near-overheated routers, which leads to the reduction of switching frequency and the hotspot problem can be eased. By considering the full temperature information, the DBA can mitigate the performance impact and synchronize the changing rate of temperature and traffic information. The experimental results show that the proposed scheme can reduce the deviation of temperature distribution by 39.4% and help to improve the full system performance by 24.8% compared with previous work.