Detecting a trojan die in 3D stacked integrated circuits
Soha Alhelaly, Jennifer Dworak, Theodore W. Manikas, Ping Gui, Kundan Nepal, Alfred L. Crouch · 2017
While 3D integrated circuits provide many security advantages, one disadvantage is the insertion of a Trojan die into the stack. In this paper, we explore a technique to detect an extra die through delay analysis.