Design Fabrication of Low Noise Gunn Diode wit:h Consideration of a Thermocompression Bonding Effect
Michio · 1976
In order to reduce llf noise generated by Gunn diodes, an experimental study was made on the effects of ther- mocompression bonding on Gunn oscillator noise. It is found that carrier traps at dislocations introduced into the Gunn diode by the thermocompression process increase the Gunn oscillator noise significantly. An optimum thermocompression bonding condition for minimizing Gunn diode llf noise is described, tak- ing into account such parameters as doping density and device area.