Fujitsu's Engineering Cloud
Mitsuru Yasuda · 2012
Product design is currently facing some issues: higher development costs, increasingly complex products, a faster time to market, cooperation between enterprises, and business continuity including measures to deal with natural calamities. To solve these issues, it is important to have simulations, information sharing and use, and linkage between tools and sections. Of course, greater effects can be obtained by having deep mutual cooperation between them. For example, electrostatic or thermal fluid simulations are performed in order to detect at an early stage of design the possibility of a device being damaged by the heat generated within it or electrostatic discharge. However, in the distributed design environment, information on housing and printed circuit board design is collected and then work begins to transfer this information to the simulation environment. This gives rise to the issues of the effort needed to copy information and information management (security). To solve them, Fujitsu thinks that by shifting the engineering design environment to the cloud, the speed of simulations, information sharing and use and linkage between tools and sections will be enhanced. It believes this will achieve product design that has a high design quality. This paper focuses on the issues in product development. As an approach to solving them, it introduces Fujitsu’s Engineering Cloud, a tool that Fujitsu is working on now.