Design of antennas for 3D wireless Network-on-Chip with micro-fluidic cooling layers
Chetan Kumar Munuswamy, Jayanti Venkataraman, Amlan Ganguly · 2016
Recent trend in 3-D Network on a Chip (NoC) utilizing wireless interconnects to improve communication speeds have been successful. Liquid cooling channels introduced on top and bottom still leave the interior of the chip as a hot spot. In the present work, novel architecture of 3-D NoC is modeled in different configurations of embedded micro fluidic layers to address the interior heating. Wired interconnects through the fluidic layers is not possible, zig-zag antennas are implemented and placed in different configurations, to serve as wireless interconnects. The thermo-fluidic layers are modeled as channels of dielectric constant 1.75. Each antenna has been individually designed and successfully tuned to resonate at 60 GHz with a return loss (RL) less than -10dB, using ANSYS High Frequency System Simulator (HFSS). The paper also discusses the transmission coefficients and shows low noise up to 10 GHz.